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dc.contributor.authorCaytuiro, Yesenia Cruzado
dc.contributor.authorNavarro Mantari, Kerling A.
dc.contributor.authorDurango, Daniel Wilfredo Burga
dc.date.accessioned2022-11-10T15:15:42Z
dc.date.available2022-11-10T15:15:42Z
dc.date.issued2022-01-01
dc.identifier.doi10.1109/INTERCON55795.2022.9870055
dc.identifier.urihttp://hdl.handle.net/10757/663448
dc.description.abstractResearch shows that around 300 million children in the world live in situations of violence in their homes. In addition, it is mentioned that the attention to these cases is not adequate in terms of attention time and treatment [1]. This paper presents a web application which obtains statistics in real time that allows specialists to show cases of physical abuse and thus be able to intervene quickly. We present a system based on Amazon Web Services (AWS) made with MySql database and the RDS service. Compared to the traditional method, a survey carried out on paper and with a data processing time. This comparison showed that the average data capture rate is lower than with the traditional method since the data is uploaded to the network instantly without the need to digitize the responses and it can also be used anywhere with internet access.es_PE
dc.formatapplication/htmles_PE
dc.language.isoenges_PE
dc.publisherInstitute of Electrical and Electronics Engineers Inc.es_PE
dc.relation.urlhttps://ieeexplore.ieee.org/document/9870055es_PE
dc.rightsinfo:eu-repo/semantics/embargoedAccesses_PE
dc.sourceRepositorio Academico - UPCes_PE
dc.sourceUniversidad Peruana de Ciencias Aplicadas (UPC)es_PE
dc.subjectanalysis of dataes_PE
dc.subjectdata processinges_PE
dc.subjectphysical abusees_PE
dc.subjectscreening tooles_PE
dc.titleAssessment System for Physical Abuse in adolescents caused by Domestic Violencees_PE
dc.typeinfo:eu-repo/semantics/articlees_PE
dc.identifier.journalProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022es_PE
dc.type.articleinfo:eu-repo/semantics/articlees_PE
dc.description.peerreviewRevisión por pareses_PE
dc.identifier.eid2-s2.0-85138772664
dc.identifier.scopusidSCOPUS_ID:85138772664
dc.source.journaltitleProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
dc.identifier.isni0000 0001 2196 144X


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