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dc.contributor.authorAmaya, Edgar Diaz
dc.contributor.authorRojas, Omar Troncos
dc.contributor.authorGuerrero, Mario Paiva
dc.date.accessioned2022-11-10T13:23:22Z
dc.date.available2022-11-10T13:23:22Z
dc.date.issued2022-01-01
dc.identifier.doi10.1109/INTERCON55795.2022.9870109
dc.identifier.urihttp://hdl.handle.net/10757/663447
dc.description.abstractThe information's management on the traceability of wood in Peru is complicated by multiple causes. In this article we present our project, which seeks to propose a technological model that allows greater efficiency in the management of timber information so that sawmills in Peru can improve their administration. Our proposed model allows us to appreciate a possible improvement in the time it takes to obtain information on the traceability of wood compared to the traditional way in which work continues in Peru. Also, in the investigation a prototype application of traceable information was developed. The main contribution of the research consists in the design of a technological model that serves as a reference to develop a technological solution for the traceability of wood in Peru.es_PE
dc.formatapplication/htmles_PE
dc.language.isoenges_PE
dc.publisherInstitute of Electrical and Electronics Engineers Inc.es_PE
dc.relation.urlhttps://ieeexplore.ieee.org/document/9870109es_PE
dc.rightsinfo:eu-repo/semantics/embargoedAccesses_PE
dc.sourceRepositorio Academico - UPCes_PE
dc.sourceUniversidad Peruana de Ciencias Aplicadas (UPC)es_PE
dc.subjectinformationes_PE
dc.subjectprototypees_PE
dc.subjecttraceabilityes_PE
dc.titleWeb Solution Based on QR Code for the Traceability of the Wood Transformation Processes_PE
dc.typeinfo:eu-repo/semantics/articlees_PE
dc.identifier.journalProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022es_PE
dc.type.articleinfo:eu-repo/semantics/articlees_PE
dc.description.peerreviewRevisión por pareses_PE
dc.identifier.eid2-s2.0-85138797097
dc.identifier.scopusidSCOPUS_ID:85138797097
dc.source.journaltitleProceedings of the 2022 IEEE 29th International Conference on Electronics, Electrical Engineering and Computing, INTERCON 2022
dc.identifier.isni0000 0001 2196 144X


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