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dc.contributor.authorCastillo, Luis Felipe
dc.contributor.authorRaymundo, Carlos
dc.contributor.authorMateos, Francisco Dominguez
dc.date.accessioned2021-06-07T17:22:26Z
dc.date.available2021-06-07T17:22:26Z
dc.date.issued2017-10-20
dc.identifier.doi10.1109/INTERCON.2017.8079701
dc.identifier.urihttp://hdl.handle.net/10757/656364
dc.descriptionEl texto completo de este trabajo no está disponible en el Repositorio Académico UPC por restricciones de la casa editorial donde ha sido publicado.en_US
dc.description.abstractThe research revealed the need to design an information architecture model for Data Governance initiative that can serve as an intercom between current IT / IS management trends: Information technology (IT) management and information management. A model is needed that strikes a balance between the need to invest in technology and the ability to manage the information that originates from the use of those technologies, as well as to measure with greater precision the generation of IT value through the use of quality information and user satisfaction, using the technologies that make it possible for the information to reach them to be used in their daily work.en_US
dc.formatapplication/pdfen_US
dc.language.isoengen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.urlhttps://ieeexplore.ieee.org/document/8079701en_US
dc.rightsinfo:eu-repo/semantics/embargoedAccessen_US
dc.sourceUniversidad Peruana de Ciencias Aplicadas (UPC)es_PE
dc.sourceRepositorio Académico - UPCes_PE
dc.subjectGenerating IT valueen_US
dc.subjectInformation Management Data governanceen_US
dc.subjectInformation Qualityen_US
dc.subjectIT Managementen_US
dc.titleInformation architecture model for the successful data governance initiative in the peruvian higher education sectoren_US
dc.typeinfo:eu-repo/semantics/articleen_US
dc.identifier.journalProceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017en_US
dc.identifier.eid2-s2.0-85040000956
dc.identifier.scopusidSCOPUS_ID:85040000956
dc.source.journaltitleProceedings of the 2017 IEEE 24th International Congress on Electronics, Electrical Engineering and Computing, INTERCON 2017
dc.identifier.isni0000 0001 2196 144X


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